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Diode side-pump YAG Laser Marker Diode end-pump Laser Marker UV Laser Wafer Marker
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Diode side-pump YAG Laser Marker Diode end-pump Laser Marker UV Laser Wafer Marker
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UV Laser Wafer Marker |
Machine look picture |
Model Characteristic This equipment is independent research and development by us. It
has a number of patented technologies, and set numerical control
technology, laser technology and mechanical technology in one.
Features are as follows: 1. Smooth and clean edges, no burrs, no dust and kernel. 2. High-precision exterior, especial suitable for cutting of small-radius exterior 3. Little heat impact to PCB and no layers broken, lower failure rate 4. Able to cut boards with different thickness or boards made from different materials in only one step. 5. Height of laser can be automatic adjusted, able to cut assembled PCB boards 6. Contact-free processing can avoid material deformation 7. High speed of linear motor, high precision, low fray, easy of maintenance, low maintenance cost. 8. Remain jig location, convenient for PCBA processing 9. Vac-sorb platform, no need jig location 10. Cutting materials into any shapes or dimensions at fast speed 11. Imported image positioning system for high-precision requirements. 12. Automatic power check system. 13. Sealed optical path,stable and reliable |
The application of materials and Industrial Applications 1. FPC exterior cutting/Auxiliary material cutting( such as
strengthen, steel disc),opening window for covering 2. Laser drilling, such as FPC drilling, LTCC drilling 3. Patch PCB molding 4. GBA repair/ Permeability gold eliminate/repair welding plate 5. SD card Cutting 6. Hard and soft board opening. |
Technical parameters Laser:Imported original laser Laser medium:Nd:YVO4 Laser wavelength:355nm Rated power:8W/30KHZ Positioning precision of worktable of linear motor:±3um Repetition precision of worktable of linear motor:±2um Effective travel of worktable of linear motor:304mm400mm CCD automatic location precision:7m Galvanometer scan field:50mmX50mm Routing of linear motor platform:500mm×500mm Processing Platform area:480mm×350mm Galvanometer repetition precision:+3m Power requirement:220V Air pressure:0.5-0.8MPa Dust collecting requirement:>5m3 /min Environment temperature:20℃±2℃ Machine dimensions:2060mm×1860mm×1590mm Weight of main unit:3300kg Data documents:Gerber standard format System processing precision:±20um |
Sample Image |
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